发明名称 FINE WIRE ADHERING DEVICE
摘要 PURPOSE:To securely adhere a fine wire to the surface of a wiring board under the condition that the fine wire is adhered to the surface of the wiring board by coating an adhesive agent to the fine wire with an adhering means under the condition that the fine wire is adhered to the surface of a wiring board by a presser means energized by an energizing means. CONSTITUTION:When a base member 11, which is supported and guided by a supporting member 10, is lowered to a wiring board 2 by a driving means, the lower surface 33a of a presser plate 33 abuts on a fine wire 3 extended along the surface of the wiring board 2. Next, when the base member 11 is lowered more, the presser plate is energized to the wiring board 2 by the force of a spring 34, and the fine wire 3 is pinched by the presser plate 33 and the wiring board 2, and adhered to the surface 2a of the wiring board 2. When the base member 11 is lowered more and abuts on a stopper part 10c of the supporting member 10 and stopped, the tip 24a of a needle 24 faces to the inside of an opening 33c of the presser plate 33, and positioned just over the fine wire. When air pressure is supplied to a wiring 25, the adhesive agent is discharged from the tip of the needle 24 toward the fine wire 3, and the fine wire 3 is coated with the adhesive agent and securely adhered to the surface 2a of the wiring board 2.
申请公布号 JPH07201438(A) 申请公布日期 1995.08.04
申请号 JP19930352246 申请日期 1993.12.29
申请人 FUJIKURA LTD 发明人 YOSHIDA HIDEKI
分类号 B05C5/00;H01R4/04;H01R43/00 主分类号 B05C5/00
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