| 摘要 |
PURPOSE:To provide a microminiature package even in the case where electrical connection is required in both top and bottom surfaces of a semiconductor element. CONSTITUTION:A semiconductor chip 1 has a pair of electrodes 11 in its top surface and an electrode 12 in its whole bottom surface. A film carrier 2 has a conductor part 4 formed in the top surface of a film base material 3 and a pair of conductor parts 5 formed in its bottom surface. The film carrier 2 has a conductor 4 formed in the top surface of the film base material 3 and a pair of the conductor parts 5 formed in its bottom surface. The top surface conductor part 4 has a pad 41 and an outer lead 42, and the bottom surface conductor part 5 has an inner lead 51 and an outer lead 52. The bottom surface of the semiconductor chip 1 is fixed on the pad 41 of the top surface conductor part 4 of the film carrier 2 by a conductive bonding agent 6, and the bottom surface electrode 12 is connected to the top surface conductor part 4. The inner lead 51 of the bottom surface conductor part of the film carrier 2 is bent in the top surface of the semiconductor chip 1 and connected to the top surface electrode 11. The top surface electrode 11 does not need wire bonding, and a bonding area, the space of a wire loop height and the like become unnecessary. so that microminiature package any be obtained. |
