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发明名称
METHOD AND APPARATUS FOR APPLYING SOLUTION AROUND SEMICONDUCTOR WAFER
摘要
申请公布号
JPH07201838(A)
申请公布日期
1995.08.04
申请号
JP19930334050
申请日期
1993.12.28
申请人
FUJI ELECTRIC CO LTD
发明人
ISHIKAWA KENJI
分类号
H01L21/31;H01L21/312;(IPC1-7):H01L21/312
主分类号
H01L21/31
代理机构
代理人
主权项
地址
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