| 摘要 |
<p>PURPOSE:To control cooling efficiency of stage on which semiconductor substrates are placed to quickly control semiconductor substrates to the desired temperature. CONSTITUTION:A stage 1 for mounting semiconductor substrates W is composed of a stage fixing section 2 on which semiconductor substrates W are placed in direct and a stage movable section 3 which can be moved with respect to the stage fixing section 2. The stage fixing section 2 is provided with holes 4 and pipings 5 to circulate therein a coolant, while the stage movable section 3 is provided with projections 6 which are moved within the holes 4. When the stage movable section 3 is moved upward, the projections 6 is placed in contact with the semiconductor substrates W. When the stage movable section 3 is separated from the semiconductor substrates W and when it is in contact with the substrates W, the cooling efficiency is changed to quickly control the substrates W to the predetermined temperature.</p> |
