| 摘要 |
PURPOSE: To form solder bumps of almost equal heights on a substrate by making the surface of a conducive material which is blanket-deposited on a conductive pattern such that where electric deposition does not occur, a part of a conductive material layer is removed and then a titanium layer is formed on it. CONSTITUTION: A dielectric 43 is deposited in a part, except for parts to which the solder bumps are formed and is patterned. A titanium layer 45 is blanket- deposited on the patterned dielectric 43 and a metallic layer 41. The titanium layer 45 is removed by leaving only the titanium layer 45 of the dielectric 43, and the metallic layer 41 is exposed. The metallic layer 47 is deposited on the titanium layer 45 and the metal layer 41, and is patterned. The titanium layer 45 is exposed. The solder bumps are deposited on the patterned metallic layer 47. Consequently, the surface of the titanium layer 45 is oxidized, and electric deposition does not occur. Thus, the solder bumps of almost equal heights can be formed on the substrate. |
