CERAMIC PACKAGE FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide a ceramic package for a semiconductor device with im proved reliability at reduced cost. CONSTITUTION:A ceramic package for a semiconductor device comprises a lead frame 4, which is bonded to the semiconductor device through wire bonding, and which is an integral part of a glass layer 3a of the ceramic package body having a glass layer on the upper periphery, its center having a semiconductor device mount 5 which has a semiconductor device 6 mounted, and gold plating 7 which has been applied only to a tip 4a of an inner lead located inside a glass sealed part 3 of the lead frame. The gold plating is applied at a current density under 2.0A/dm<2> to plate 0.5 to 3.0mum thick and a bonding wire for the wire bonding is an aluminum wire 8.