发明名称 MANUFACTURE OF SEMICONDUCTOR ELECTRIC HEAT FILM
摘要 PURPOSE: To form an exothermic thin film of thickness in a specific range with a coating of atomization growth for shorter heating period by preparing a material with the amount of admixture as a weight in a specific range, material-mixing the material and medium to the weight in a specific range, and further, treating the material at a temperature in a specific range for a specific period. CONSTITUTION: With a metal compound as main constituent, its mount is material-prepared (10) by a weight of 1-10%, using such compound as antimony of appropriate amount as an admixture during the manufacturing process. Then the material is evenly agitated, mixed with a medium such as water, so that material is mixed by a weight of 20-60% in amount. Meanwhile, a base material 12 quartz or the like is washed, dried, and hated, and it is left in a stove at a high temperature of 400-850 deg.C for 10-30 minutes. Lastly, atomization growth (13) is allowed to conducted to a coating thickness of 3-300μ, and a semiconductive-type exothermic thin film is formed, as one body, together with the base material. Thus, heating is performed quickly to realize effect of saving of electricity.
申请公布号 JPH07202273(A) 申请公布日期 1995.08.04
申请号 JP19930313306 申请日期 1993.12.14
申请人 URANPU ENTERP CO LTD 发明人 RIN PANNTEIEN
分类号 H01L35/00;H01L37/00;(IPC1-7):H01L35/00 主分类号 H01L35/00
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