| 摘要 |
<p>PURPOSE:To provide a ceramic circuit board capable of preventing the generation of solder cavities at the time of joining a semiconductor device to a copper circuit board with solder. of decreasing the dispersion of the thermal resistance value between the semiconductor device and a ceramic board, and of lowering thermal stress acting on a semiconductor device mounted part. CONSTITUTION:This invention concerns ceramic circuit boards 1a and 1b obtained by arranging copper circuit boards 3a, 3b and 3c on specified positions on a ceramic board 2, heating them, and joining the copper circuit boards directly, or uniting them into a body with soldering material containing active metals such as Ti, Zr, Hf, etc., and by joining a semiconductor device 5 to a semiconductor device mounting part on this copper circuit board 3a by the aid of a solder layer. A copper board element 10 having grooves 9 or holes is joined to the semiconductor device mounting part, and a semiconductor device 5 is joined into a united body by the aid of a solder layer on to a surface of this copper board element 10 where the grooves 10 or holes have been formed.</p> |
