| 摘要 |
<p>A cavity-containing structure and a method for making same are disclosed. The method for making a structure comprising a substrate (2) and a thin surface wafer (12) made of non-conductive material secured to one side (1) of the substrate (2), said substrate (2) containing cavities (10) flush with said side (2), comprises the steps of etching cavities (10) into one side (1) of a substrate, said cavities having, in the surface plane of the substrate, at least one dimension which is a function of the thickness of the surface wafer, whereby said wafer is properly held in place; bonding a wafer (12) made of non-conductive material to the side (1) of the substrate (2); and reducing the thickness of the wafer (12) to provide said thin surface wafer.</p> |
