Heat-sink for power semiconductor devices, e.g. converters in test equipment

摘要

The heat-sink includes a liquid coolant which partially fills a hermetically sealed hollow cavity. The heat sink body is made of an efficient heat-conducting material and has contact surfaces for the positioning of semiconductor structures. The cavity is specifically formed from one or more hollow bodies (3). Each body has a bottom hermetic seal as a heat conducting device (5), and a top hermetic seal as a cover (1).