| 摘要 |
<p>PURPOSE:To lower cost and increase density and reliability by integrally forming a heating resistor for heat-sensitive recording, isolating diode, matrix circuit, external lead terminals, etc. on a sapphire substrate. CONSTITUTION:By making use of the Si layer formed on a sapphire substrate 1, a Si heating resistor 2, isolating diode 3 and head control circuit 11 are formed by way of a heat accumulation layer 18 such as of SiO2, etc. and further a matrix circuit 4, external lead terminals 7, wiring conductors 8, etc. are formed. A glass-reinforced epoxy printed board 12 is provided by means of an adhesive agent 13 on the back of the substrate 1 and a high heat conductivity substrate 5 is provided on the remaining back by means of an adhesive agent 6. The board 12 is bonded to the notch part 15 of the substrate 5. The circuit 11 consists of (m) row driving control circuits 11a and (n) column driving control circuits 11b and is isolated thermally from the resistor 2 together with the diode 3 by means of thermally isolating grooves 19.</p> |
