| 摘要 |
PURPOSE:To improve solder heat resistance, thermal pressure resistance, bending workability and adhesive properties of an insulating layer by composing the insulating layer of a first insulating layer formed of heat resistant resin at the side of a copper foil, and a second insulating layer formed of thermosetting resin at the side of a metal plate. CONSTITUTION:In a laminated plate in which a copper foil 1 is adhered through an insulating layer to a metal plate 4, the insulating layer is composed of a first insulating layer 2 at the side of the foil 1, and a second insulating layer at the side of the plate 4. The layer 2 is formed of heat resistant resin having 200 deg.C or higher of glass transition point and a normal chain structure such as polyimide, polyamideimide, etc., its thickness is preferably 10mum to 40mum, thereby obtaining heat pressure resistant effect. The second layer 3 is formed of thermosetting resin modified with maleimide resin. As the maleimide, epoxy resin, phenol resin, etc., are employed, and they are modified to provide excellent performance in the adhesive properties, solder heat resistance with the layer 2 without loss of bending workability. |
