发明名称 |
Semiconductor structure and method of fabricating the same. |
摘要 |
<p>A semiconductor structure includes a first semiconductor barrier layer formed on a compound semiconductor substrate, a semiconductor carrier confinement layer formed on the semiconductor barrier layer, and a second semiconductor barrier layer arranged on the semiconductor carrier confinement layer. The semiconductor carrier confinement layer includes a plurality of islands spaced apart from each other and having an almost equal thickness, and a thin quantum well film arranged between the islands and having a thickness smaller than the thickness of the islands. <IMAGE></p> |
申请公布号 |
EP0665578(A2) |
申请公布日期 |
1995.08.02 |
申请号 |
EP19940118561 |
申请日期 |
1994.11.25 |
申请人 |
NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
发明人 |
NOETZEL, RICHARD;TEMMYO, JIRO;TAMAMURA, TOSHIAKI;SUGO, MITSURU;KURAMOCHI, EIICHI;NISHIYA, TERUHIKO |
分类号 |
G02F1/017;H01L33/06;H01S5/32;H01S5/34;H01S5/343;(IPC1-7):H01L21/205;G02F1/015;H01S3/19;H01L33/00 |
主分类号 |
G02F1/017 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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