| 摘要 |
PURPOSE:To obtain a new thermosetting resin useful as a semiconductor sealing material, a printed-wiring board, etc., providing a cured material having low water absorbing ratio and a low dielectric constant. CONSTITUTION:This thermosetting resin of formula I ((n) is 1.1-20; R is H, a 1-5C alkyl, etc.; R1 and R2 are each independently H, a 1-100C alkyl, etc., and a case wherein R1=R2=H is omitted) is obtained by reacting an epoxy resin of formula II with 1.0-5.0-mol of a sulfurizing agent (thiourea) based on 1mol of the epoxy group of the epoxy resin. |
