| 发明名称 |
Thermosetting resin composition |
| 摘要 |
A thermosetting resin composition containing a silane compound a) having at least one phenolic hydroxyl group, and an organic compound b) having at least two functional groups capable of reaction with the phenolic hydroxyl group of the silane compound, wherein the silane compound a) is added in an amount of more than 10 parts by weight relative to 100 parts by weight of the organic compound b).
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| 申请公布号 |
US5438113(A) |
申请公布日期 |
1995.08.01 |
| 申请号 |
US19930040267 |
申请日期 |
1993.03.30 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SHIMOZAWA, HIROSHI;FUJIEDA, SHINETSU;HAYASE, SHUZI;NAKANO, YOSHIHIKO;YOSHIZUMI, AKIRA;UCHIDA, KEN |
| 分类号 |
C08G77/60;C08L63/00;C08L79/08;C08L83/16;C08L101/00;(IPC1-7):C08G77/04 |
主分类号 |
C08G77/60 |
| 代理机构 |
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代理人 |
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