发明名称 |
Lead frame and manufacturing method therefor |
摘要 |
An inner lead of a lead frame has an outer end portion extending so as to be connected with a side surface of an etching stop layer and with an upper surface of an outer lead. The outer lead is formed by etching both surfaces of a metal base, and the inner lead is formed by plating metal on the metal base with a resist layer used as a mask. The pitch of the outer lead can be made fine, and a bonding strength of the inner lead to the outer lead can be increased.
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申请公布号 |
US5437764(A) |
申请公布日期 |
1995.08.01 |
申请号 |
US19940248096 |
申请日期 |
1994.05.24 |
申请人 |
SONY CORPORATION |
发明人 |
OHSAWA, KENJI;ITO, MAKOTO;NAGANO, MUTSUMI |
分类号 |
C23F1/00;H01L21/48;H01L21/60;H01L23/495;H01L23/50;(IPC1-7):B44C1/22;C23F1/02 |
主分类号 |
C23F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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