发明名称 Lead frame and manufacturing method therefor
摘要 An inner lead of a lead frame has an outer end portion extending so as to be connected with a side surface of an etching stop layer and with an upper surface of an outer lead. The outer lead is formed by etching both surfaces of a metal base, and the inner lead is formed by plating metal on the metal base with a resist layer used as a mask. The pitch of the outer lead can be made fine, and a bonding strength of the inner lead to the outer lead can be increased.
申请公布号 US5437764(A) 申请公布日期 1995.08.01
申请号 US19940248096 申请日期 1994.05.24
申请人 SONY CORPORATION 发明人 OHSAWA, KENJI;ITO, MAKOTO;NAGANO, MUTSUMI
分类号 C23F1/00;H01L21/48;H01L21/60;H01L23/495;H01L23/50;(IPC1-7):B44C1/22;C23F1/02 主分类号 C23F1/00
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