Multi-stage heat sink

摘要

A multi-stage heat sink for cooling an integrated circuit module is described. The heat sink is preferably formed by an assembly of plates. A unique arrangement of slots in each plate forms different stages of air flow channels. Each stage contains a different number of slots with the number of slots increasing in successive stages. Thermal conduction of heat away from the module through fins which define the air flow channels is balanced against convective heat transfer from air flow channel walls at each stage to improve total heat transport per heat sink volume and to achieve a very low thermal resistance heat sink.