发明名称 High breakdown voltage semiconductor device
摘要 A high breakdown voltage semiconductor device includes a semiconductor substrate, an insulating layer formed on the semiconductor substrate, an active layer formed on the insulating layer and made of a high resistance semiconductor of a first conductivity type, a first impurity region of the first conductivity type formed in the active layer, and a second impurity region of a second conductivity type formed in the active layer and spaced apart from the first impurity region by a predetermined distance. The first impurity region is formed of diffusion layers. The diffusion layers are superimposed one upon another and differ in diffusion depth or diffusion window width, or both.
申请公布号 US5438220(A) 申请公布日期 1995.08.01
申请号 US19930085056 申请日期 1993.07.02
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NAKAGAWA, AKIO;YASUHARA, NORIO;MATSUDAI, TOMOKO;YAMAGUCHI, YOSHIHIRO;OMURA, ICHIRO;FUNAKI, HIDEYUKI
分类号 H01L21/336;H01L21/74;H01L21/762;H01L27/06;H01L27/092;H01L27/12;H01L29/06;H01L29/08;H01L29/40;H01L29/739;H01L29/74;H01L29/745;H01L29/749;H01L29/78;H01L29/786;H01L29/861;(IPC1-7):H01L29/74 主分类号 H01L21/336
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