| 摘要 |
Disclosed is a modified epoxy resin composition comprising a resin having recurring units represented by the following general formula: <IMG> wherein R1 stands for -CH2-,<IMG> , <IMG>, <IMG>, <IMG> or <IMG> , R2 stands for H or -CH3, R3 stands for H or a halogen atom, and having an epoxy group, a phenolic hydroxyl group and a primary alcoholic hydroxyl group as terminal functional groups in specific amounts. This composition has a high reactivity with an active methylol group, and when this composition is combined with a curing agent resin such as an amino resin or a phenolic resin, a coating having an excellent bending processability is obtained.
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