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发明名称
DEVICE FOR CUTTING LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH07193177(A)
申请公布日期
1995.07.28
申请号
JP19930330337
申请日期
1993.12.27
申请人
NEC YAMAGATA LTD
发明人
SASAKI ATSUSHI
分类号
B26D7/18;B23Q7/04;H01L23/50;(IPC1-7):H01L23/50
主分类号
B26D7/18
代理机构
代理人
主权项
地址
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