| 摘要 |
PURPOSE:To suppress the adhesion of organic components to lead planes and improve the bonding ability of metal fine wires. CONSTITUTION:A polyimide tape 2a is employed as an insulating tape with which a semiconductor chip 3 is mounted on the inner leads 1a of a lead frame l. Thermosetting adhesive 2c is applied to the semiconductor chip side surface of the polyimide tape 2a. The semiconductor chip 3 is mounted on the inner leads 1a with the insulating tape 2 and bonded and fixed to the inner leads 1a by a heat treatment. It is suppressed that organic components in the thermosetting adhesive 2c of the insulating tape 2 are scattered and made to adhere to the lead planes during the heat treatment and the bondability of metal fine wires 4 can be improved. |
