| 摘要 |
PURPOSE:To provide a multilayer gold-plated electrode including a gold bump having the excellent adhesiveness. CONSTITUTION:A multilayer gold-plated electrode includes a first gold-plating layer 4, a Ti middle layer 5 having a thickness of 300-700Angstrom , an Au middle layer 6 having a thickness of 800-1500Angstrom and a second gold-plating layer 7 which are built up successively. The adhesiveness between the first gold-plating layer 4 and the second gold-plating layer 7 can be significantly improved by a heat treatment at a temperature not lower than 250 deg.C and for a time not shorter than 10 minutes. |
