| 摘要 |
PURPOSE: To provide a shape of a ball contact at an initial stage and to form a hard-to-break electric contact by making a solder contact have a contact top surface on the same plane with the top surface of a solder mask, having the top surface and the peripheral wall of a bond pad. CONSTITUTION: A solder mask layer 116 has a solder mask wall 118 and a top surface 120. The solder mask wall 118 surrounds a solder pad 114 and prescribes a partitioned region 122. The region 122 is preferably square form, the wall completely surrounds the pad 114, and then the volume of the wall is prescribed. Further, a solder contact 402 which is made flat includes a contact 404, whose top surface is flush with the top surface 120 of the solder mask. Consequently, when a package is completed, the flat solder contact 402 is made to reflow, and a solder ball similar to the solder ball 302 can be formed again. |
