| 摘要 |
PURPOSE:To obtain a stable connection state by a method wherein a ball bump having a protrusion is formed on the electrode pad of a semiconductor chip and a conductive ball is held between the mounting pad of a board and the ball bump having a protrusion and the mounting pad, the conductive ball and the ball bump having a protrusion are connected to each other with conductive paste. CONSTITUTION:A ball bump 4 having a protrusion is formed on the electrode pad 3 of a semiconductor chip 1 by a wire bonder and a solder paste 5 is applied to the upper part of the ball bump 4 by a transfer method. On the other hand, a solder paste 5 is applied to the mounting pad 7 of a board 2 by a screen printing method and a metal ball 6 is placed on the solder paste 5. Then the ball bump 4 having a protrusion and the metal ball 6 are aligned with each other and the semiconductor chip 1 is mounted on the board 2 and the solder paste 5 is heated and melted to connect the ball bump 4 having a protrusion, the metal ball 6 and the mounting pad 7. If a gap between the board 2 and the semiconductor chip 1 is large, the chip 1 is connected to the board 2 with the ball bump 4 having a protrusion and the metal ball 6. If the gap is small, the metal ball 6 is deformed and the connection is performed in a stable state. |
