发明名称 METHOD OF PROCESSING CERAMIC GREEN SHEET WITH FILM
摘要 <p>PURPOSE:To form a specified through hole in a sheet alone without damaging a film by casting laser beam of normal pulse to a sheet side of a ceramic sheet with a film. CONSTITUTION:After a sheet with a film is mount in a specified direction on an XY table with the sheet up, the XY table is properly moved and positioned. The sheet is moved in +X direction at a fixed velocity. When a movement amount in the direction attains an initial boring position, laser beam of normal pulse wherein the product of laser beam output and a pulse width is set equivalent to a heat amount which can dissolve and gasify a sheet material portion is directed toward a moving sheet by one shot to form a through hole in a sheet. Laser beam is cast every specified movement amount to form N-through holes in an X-direction. The above process is performed also for +Y-direction to form N-through holes. Therefore, a specified through hole can be formed without damaging a film.</p>
申请公布号 JPH07193375(A) 申请公布日期 1995.07.28
申请号 JP19930332103 申请日期 1993.12.27
申请人 TAIYO YUDEN CO LTD 发明人 NAKAZAWA CHIKASHI
分类号 B23K26/00;B23K26/38;C04B41/91;H01F17/00;H05K3/00;H05K3/46 主分类号 B23K26/00
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