| 摘要 |
PURPOSE: To provide a method for forming an integrated circuit package by using a dambarless lead frame and its device. CONSTITUTION: A dambarless lead frame is inserted between a lower mold die 3 and an upper mold die 4. A resin leakage prevention means prevents a resin from being leaked between the lower mold die 3 and the upper mold die 4, along leads of the dambarless lead frame in the molding process for a mold housing. The resin leakage prevention means prevents leakage of the resin by adhering a tape to the leads, forming an extended face wider than the width of each lead to each lead or forming a recessed/projected notch to each lead, so as to increase the fluid resistance of the resin. A plurality of rectangular openings are provided and a auxiliary lead frame fixed to the lower mold die 3 is used to prevent leakage of the resin through the rectangular openings. |
