| 摘要 |
PURPOSE:To provide a resin-sealed semiconductor device, which can cope with the increased integration, a compact and thin configuration, and light weight needs. CONSTITUTION:A semiconductor element 2 is fixed to the surface of a heat sink 1. A lead frame 3 is electrically connected to each electrode arranged on the semiconductor element 2 through a bonding wire 5. One end part of the lead frame 3 is sealed. The heat sink 1, the semiconductor element 2, a part of the lead frame 3 and the bonding wire 5 are sealed and held with a resin 4. As the heat sink 1, the material having the specific gravity of 3.0g/cm<3> or less, the thermal expansion coefficient of 5X10<-6>m/ deg.C or more and 10X10<-6>m/ deg.C or less and the thermal conductivity of 0.2cal/cm.sec. deg.C is used. |
