发明名称 FORMATION OF CIRCUIT PATTERN USING LASER AND CIRCUIT BOARD
摘要 PURPOSE:To provide a method of manufacturing efficiently a molded item, which is used as a circuit component in the field of an electrical apparatus, an electronic equipment and the like and has an accurate conductive circuit on the surface. CONSTITUTION:In a method wherein a metal thin film formed on the surface of a synthetic resin molded item is irradiated with laser beam, the metal thin film is removed to conduct the formation of a circuit pattern and a circuit is formed by electroplating, the thickness of the metal thin film is set in a thickness of 0.2 to 2.0mum and is the metal thin film formed on the surface of the molded item to remove the metal thin film in a width of 100 to 500mum is irradiated with the laser beam having a laser spot diameter of 50 to 500mum.
申请公布号 JPH07193356(A) 申请公布日期 1995.07.28
申请号 JP19930331257 申请日期 1993.12.27
申请人 POLYPLASTICS CO 发明人 MIYASHITA TAKAYUKI
分类号 B23K26/00;H05K3/08;H05K3/24 主分类号 B23K26/00
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