发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT AND ITS MANUFACTURE
摘要 <p>PURPOSE:To set an identification dode corresponding to a kind even when the kind is changed by a bonding operation in an assembly process. CONSTITUTION:In a functional circuit part 2, one circuit out of four kinds of circuits whose function is different only in a part is operated according to whether pads 6, 7 for bonding option are bonded to a GND pin or not. When the pads 6, 7 for bonding option are bonded to the GND pin, a bonding judgment part 3 outputs a low level to the functional circuit part 2 and an ID-code setting part 4. When they are not bonded to the GND pin, the bonding judgment part outputs a high level to the functional circuit part 2 and the ID-code setting part 4. The ID-code setting part 4 selects one ID code out of four kinds according to the level which is output by the bonding judgment part 3. An ID-code register 5 holds the ID code, and it outputs the value of the ID code to a pad 8 for ID-code output by a shift clock from a pad 9 for shift clock.</p>
申请公布号 JPH07192979(A) 申请公布日期 1995.07.28
申请号 JP19940119931 申请日期 1994.06.01
申请人 NEC CORP 发明人 UCHIDA KATSUNORI;KOBAYASHI KATSUTARO;FUKUSHIMA TATSUHIRO
分类号 H01L21/02;G11C5/00;G11C11/401;H01L21/822;H01L27/04;(IPC1-7):H01L21/02 主分类号 H01L21/02
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