An intergrated circuit formed in a semiconductor die which has at least two distinct functional regions is treated by mounting the die by way of its front face on a support member, and subsequently removing die material by way of its back face so as to physically separate the functional regions of the die from each other. The optically opaque dielectric material (66) is optional.
申请公布号
DE3853335(T2)
申请公布日期
1995.07.27
申请号
DE19883853335T
申请日期
1988.10.10
申请人
SCIENTIFIC IMAGING TECHNOLOGIES, INC., BEAVERTON, OREG., US
发明人
CORRIE, BRIAN L., GASTON OREGON 97119, US;HEIDTMANN, DENIS L., PORTLAND OREGON 97225, US;BLOUKE, MORELY M., BEAVERTON OREGON 97006, US