| 发明名称 |
Reducing solubility of copper@ objects in contact with aggressive media |
| 摘要 |
Reducing the solubility of Cu ions of Cu (alloy) objects in contact with aggressive effluents or other aggressive media specific for Cu, esp. effluents having a pH of less than 7, comprises providing the surfaces of the objects with a coating of nano-composites obtd. by a sol-gel method.
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| 申请公布号 |
DE4401671(A1) |
申请公布日期 |
1995.07.27 |
| 申请号 |
DE19944401671 |
申请日期 |
1994.01.21 |
| 申请人 |
KM-KABELMETAL AG, 49074 OSNABRUECK, DE |
发明人 |
REITER, ULRICH, DR., 49080 OSNABRUECK, DE |
| 分类号 |
C23C18/12;(IPC1-7):C23C24/08;C04B37/02;B05D3/06;B05D1/18;B05D7/20;B05D7/22;B05D7/24;H01B3/12 |
主分类号 |
C23C18/12 |
| 代理机构 |
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