Electroless plating soln. for palladium deposition

摘要

A soln. for the electroless deposition of Pd contains A) as known a) 0.0001-0.5 mol./l Pd cpd. b) 0.001-8 mol./l NH3 and/or an amine cpd. pref. a mono-, di- or polyamine, an amino acid or imidazoline, esp. ethylenediamine or diethylenetriamine and c) 0.005-1 mol./l of a cpd. of hypophosphoric acid and/or a BH3 cpd. and B) 1-500 mg/l of S(Ph)2,S(-CH2-COOH)2,S(-CH2-COOH)2 or (1) pref. also C) 0.001-1 mol./l Ni cpd.. The soln. pref. has a pH 5-10 and when an Ni cpd. is present 5-11.