| 摘要 |
<p>A cover or shroud extends over a solder reservoir and has a slot for a solder wave to protrude therethrough. Gas is provided to blanket the solder wave and the shroud is positioned to reduce solder from contacting elements that are conveyed through the solder wave. The device comprises a solder reservoir having at least one solder nozzle projected therefrom, a pump for forming a solder wave from the nozzle, a cover for covering at least a portion of the reservoir containing the solder wave, the cover having a longitudinal slot for the solder wave to pass therethrough and contain solder splatter caused by the solder wave falling into the solder reservoir. A gas supply provides gas under the cover and also provides a gas blanket over the solder wave, and a conveyor moves the element in a predetermined path over the cover ensuring at least a portion of the element passes through the solder wave.</p> |
