发明名称 |
Formation of heat-resistant dielectric coatings. |
摘要 |
<p>Heat resistant, dielectric coatings are formed by applying a heat resistant coating composition comprising an organic silicon polymer, a silazane compound, and an inorganic filler to a substrate, and baking the coating in ammoniacal atmosphere at 200 to 1000 DEG C. Similarly, heat resistant, dielectric coatings are formed by applying the same composition as above to a substrate, baking a first coating layer in air, applying an organic silicon polymer base coating composition to the first coating layer, and baking a second coating layer in ammonical atmosphere.</p> |
申请公布号 |
EP0489428(B1) |
申请公布日期 |
1995.07.26 |
申请号 |
EP19910120852 |
申请日期 |
1991.12.04 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
TAKEDA, YOSHIHUMI;ISHIHARA, TOSHINOBU;ITO, KEN'ICHI |
分类号 |
B05D3/04;C04B41/50;C04B41/52;C04B41/87;C04B41/89;C09D183/16;C23C18/12;(IPC1-7):B05D3/04 |
主分类号 |
B05D3/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|