发明名称 SEMICONDUCTOR MANUFACTURING EQUIPMENT.
摘要 <p>Semiconductor manufacturing equipment for forming a film on a wafer through the CVD method, which makes it possible to easily remove dusts produced in a chamber without decreasing the serviceability ration of the equipment and has at least one gas disperser (1) to discharge reactive gas for forming a film on a wafer from a gas discharging surface (2) and at least one wafer holder (3) having a wafer mounting surface (4) facing a plane including the gas discharging surface (2); wherein at least one cleaner (7) having a suction port (5) and a brush (6) connected with the suction port (5) is installed so that it faces the plane including the gas discharging surface (2), either cleaner (7) or gas disperser (1) moves while the cleaner (7) faces the plane including the gas discharging surface (2), and the brush (6) contacts the gas discharging surface (2). This equipment is useful as a continuous-type automated CVD system. <IMAGE></p>
申请公布号 EP0526644(B1) 申请公布日期 1995.07.26
申请号 EP19920904981 申请日期 1992.02.12
申请人 SEMICONDUCTOR PROCESS LABORATORY CO., LTD.;CANON SALES CO., INC.;ALCAN-TECH CO., INC. 发明人 MAEDA, KAZUO SEMICONDUCTOR PROCESS LAB. CO. LTD.;OHIRA, KOUICHI SEMICONDUCTOR PROCESS LAB. CO. LTD.;HIROSE, MITSUO
分类号 H01L21/205;C23C16/44;H01L21/00;(IPC1-7):H01L21/31 主分类号 H01L21/205
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