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发明名称
Soldering composition
摘要
A soldering composition consisting essentially of an alloy comprising tin, indium, antimony, silver and in the range of 0.0% to about 10.5% by weight bismuth.
申请公布号
US5435857(A)
申请公布日期
1995.07.25
申请号
US19940178102
申请日期
1994.01.06
申请人
QUALITEK INTERNATIONAL, INC.
发明人
HAN, TIPPY H.;HAN, PHODI
分类号
B23K35/26;C22C13/00;(IPC1-7):C22C13/00
主分类号
B23K35/26
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代理人
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