| 发明名称 |
Electronic coatings using filled borosilazanes |
| 摘要 |
The present invention relates to a method of forming coatings on electronic substrates and the substrates coated thereby. The method comprises applying a coating comprising a borosilazane and a filler on a substrate and heating the coated substrate at a temperature sufficient to convert the borosilazane to a ceramic coating.
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| 申请公布号 |
US5436084(A) |
申请公布日期 |
1995.07.25 |
| 申请号 |
US19940223297 |
申请日期 |
1994.04.05 |
| 申请人 |
DOW CORNING CORPORATION |
发明人 |
HALUSKA, LOREN A.;MICHAEL, KEITH W. |
| 分类号 |
B01J19/00;C04B35/622;C23C24/08;C23C26/00;H01B3/12;H01L21/316;H01L23/29;H05K1/03;(IPC1-7):B32B9/00 |
主分类号 |
B01J19/00 |
| 代理机构 |
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