| 摘要 |
A test card (10) or a semiconductor die (150) having bonding pads (41-43, 180-182) for testing semiconductor devices, and a method for making the bonding pads (41-43, 180-182) are shown. The test card (10) or the semiconductor die (150) is partitioned into a plurality of bonding pad regions (14-17 and 170-173). Bonding pads (41-43, 180-182) are formed in the respective bonding pad regions (14-17 and 170-173). The bonding pad regions (14-17 and 170-173) and the bonding pads (41-43, 180-182) are formed by patterning a layer of conductive material (16, 167) on a major surface (12) of the test card (10) or on the semiconductor die (150).
|
