| 摘要 |
<p>PURPOSE:To retain a semiconductor wafer to the tip of a substrate fork and then prevent position deviation despite vibration on transfer by providing a cut-out part at a part colliding with the post of a wafer boat at the main part of the substrate fork. CONSTITUTION:Since a cut-out part 44 is provided at the tip part of a substrate fork 30, a semiconductor wafer 4 can be transferred from a substrate fork 30 to a wafer boat 3 or vice versa without causing the collision of the post 43 of the wafer boat 3 when transferring between the substrate fork 30 and the wafer boat 3. Further, even if vibration in horizontal direction or of rotary move by a transfer machine 21 during the placement or vibration in up/down movement by a raise/lower mechanism 22 is applied to the substrate fork 30, side deviation can be prevented by a protruding part 40 located at the substrate fork 30, thus preventing a falling accident. Also, the cut-out part 44 provided at the substrate fork 30 is matched to the shape of the wafer boat 3 and a protruding part 40 can be left in a state for supporting the semiconductor wafer 4 to cope with any shape.</p> |
