| 摘要 |
PURPOSE: To enhance reliability while keeping perfect compatibility with a currently utilized mounting process on a main substrate by an arrangement wherein the entire profile of a semiconductor device conform to the regulations of an SOJ package. CONSTITUTION: After through holes 48 are made in the center at the opposite ends of the upper and lower surfaces of a main substrate 31, a central conductor is removed from the through hole 48 of lower surface to obtain an annular through hole for connecting an external connection terminal, i.e., a lead 38. Copper, nickel and gold are then plated sequentially around the through hole 48 to form a plating layer 35. A land pattern 47, an electrode connection terminal 33 and a ball grid array 35 are then patterned around the plating layer 35 formed on the upper and lower surfaces of the main substrate 31. Subsequently, a semiconductor chip 32 is mounted in the center of the main substrate 31 and connected with a lead 38 by bonding. Finally, brazing balls of specified shape are provided on the ball grid array 35 having the through hole 48 thus producing a BGA package. |
