| 摘要 |
PURPOSE:To reduce the power supply noise of a chip mounted on a package, and prevent the malfunction of a circuit in the chip, in a PGA. CONSTITUTION:Pins are arranged on both of the surfaces of a PGA, pins 7 for a power supply are arranged on one surface, and pins 2 for a signal are arranged on the other surface. Thereby a power supply wiring 8 can be made thick and short, and the power supply wiring 8 can be largely separated from a signal wiring 3. As a result, impedance, inductance and parasitic capacitance of the wiring in a package are reduced, and the power supply noise or the malfunction of a chip 6 is prevented. |
