| 摘要 |
PURPOSE: To provide a header for a semiconductor device having a ground post laser bonded to the ground lead of a lead frame. CONSTITUTION: A post 28 is projected from the metal of a header substrate 20 or secured mechanically and electrically to a fixing tab. The ground lead 23 of a lead frame, having an opening at one end 26 thereof, is fitted to the ground post 28 and bonded thereto by a laser beam for melting the metals thereof. |
