发明名称 |
RIGID FLEXIBLE MULTILAYER PRINTED BOARD |
摘要 |
PURPOSE:To follow an elongation or compression and to easily fold by filling flexible curable resin in a space cut in a specific width at one position of a bent part of a glass cloth base material. CONSTITUTION:Sheets each formed of a two-sided copper-clad layer 1 of glass cloth epoxy resin, a glass cloth base material flexible thermosetting resin prepreg 2 and a copper-clad layer 3 of glass cloth-base flexible thermosetting resin in an inner layer circuit are superposed to be integrated between rigid circuit boards 1. A bending part of the integrated base material is cut in a width of 0.5-5mm to form a space. The space is filled with resin 5 fed from the prepreg 2. Thus, it can follow its elongation or compression, be easily folded, and a large strength can be obtained. |
申请公布号 |
JPH07183663(A) |
申请公布日期 |
1995.07.21 |
申请号 |
JP19930327909 |
申请日期 |
1993.12.24 |
申请人 |
MITSUBISHI GAS CHEM CO INC |
发明人 |
TAKE MORIO;URABE HIROYUKI;TANAKA YASUO;NOZAKI MITSURU |
分类号 |
H05K1/02;H05K3/00;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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