发明名称 PROCESSING METHOD FOR SUBSTRATE
摘要 <p>PURPOSE:To detect an accurate processing position in a short time without using the CAD system by moving a stage under a condition, in which the processing position of a substrate for specifying the processing position is detected, fixing the stage, and processing the substrate for processing. CONSTITUTION:Fixing both chips onto a stage is performed by matching the angles of a lower left pad of both chips under the microscope and under the FIB equipment, then matching the angles of an upper right pad of both chips to lock. In this condition, as a stage 1 moves, a chip for processing moves under the FIB equipment 4, while a chip for specifying a processing position simultaneously moves under a microscope 5. Next, the chip for specifying the processing position is moved to under the microscope. Upon detection of a processing part 3CA of that circuit pattern 3C, a processing part 2CA of a pattern 2C of the processing chip comes to an irradiating position of a focusing ion of the FIB equipment. This enables an accurate processing position to be detected in a short time without using the CAD system.</p>
申请公布号 JPH07183642(A) 申请公布日期 1995.07.21
申请号 JP19930325498 申请日期 1993.12.24
申请人 FUJITSU LTD 发明人 TAWARA KATSUJI;HAGINO ICHIRO
分类号 H05K3/22;H01L21/265;H01L21/68;(IPC1-7):H05K3/22 主分类号 H05K3/22
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