| 摘要 |
PURPOSE:To obtain a heat-treating device which can improve the yield of semiconductor devices by carrying semiconductor wafers in and out of a boat with less amounts of dust adhering to the wafers and, at the same time, which can uniformly form films on the wafers by providing first to third boat covering bodies and a wafer carrying device to the heat-treating device. CONSTITUTION:A heat-treating device is provided with first boat covering bodies 25 and 27 which are installed to a boat 11 and cover the circumference of a wafer train at prescribed intervals and first opening 28 which are installed to the covering bodies 25 and 2 and have widths wider than the diameter of wafers 10. The heat-treating device is also provided with second openings 29 in the covering bodies 25 and 27 which have widths narrower than those of the sections 28. In addition, the heat-treating device is also provided with a wafer carrying device 17 having a projection which limits the movement of the wafers 10 to the front end side of an arm 16 at the front end section of the arm 16 which supports and carries the wafers 10 and second and third boat covering bodies 34 and 36 which respectively cover the first and second openings 28 and 29. |
