| 摘要 |
<p>PURPOSE:To improve optical characteristics and at the same time to increase a manufacturing yield by providing a gap between the peripheral edge of a translucent plate arranged on a translucent resin buried inside an opening part and the peripheral edge of the opening part to pass a bubble generated in the translucent resin to the exterior. CONSTITUTION:A semiconductor device 1 is constituted of a base 2 for mounting a semiconductor element 10 nearly at the center, a frame 3 provided with an opening part 31 in the upper region of the semiconductor element 10 provided on the base 2, a translucent resin 4 filled up in the opening part 31 and a translucent plate 5 arranged on the translucent resin 4. Further, since a gap 51 is provided between the peripheral edge of the translucent plate 5 and the peripheral edge of the opening part 31, a bubble generated in the translucent resin 4 is passed through the gap 51 to the exterior. The translucent plate 5 is arranged in a notched part 32, thereby being able to accurately maintain a distance between a bonding wire 6 to be connected with a lead 7 and the bottom surface of the translucent plate 5.</p> |
