| 摘要 |
<p>PURPOSE:To especially improve the transmission characteristics (signal delay) of a high frequency signal, and remarkably decrease crosstalk noise or the like by using a package having a lead frame structure of low cost. CONSTITUTION:A semiconductor chip 2 is mounted in the cavity 1a or a ceramics substrate 1. A lead frame 6 wherein at least the surface of a wiring part is covered with an insulating layer 5 is bonded to the semiconductor mounting surface side of the ceramics substrate 1, with conductive sealing material 4 which is electrically connected with a reference voltage like a ground voltage, a power supply voltage, etc. The semiconductor chip 2 and the lead frame 6 are electrically connected through bonding wires 7.</p> |
