发明名称 |
MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARD |
摘要 |
PURPOSE:To reduce the number of steps by conducting the step of electrically connecting to be executed for a surface blind viahole of a multilayer printed circuit board simultaneously upon the other step. CONSTITUTION:A land 6 is electrically connected to a land 7 via solder 11 by allowing solder paste 10 to reflow after the paste 10 is metal screen printed on a surface blind viahole 12 of a multilayer printed circuit board. |
申请公布号 |
JPH07183664(A) |
申请公布日期 |
1995.07.21 |
申请号 |
JP19930345113 |
申请日期 |
1993.12.21 |
申请人 |
CMK CORP |
发明人 |
MATSUMOTO MASUO;TAKAHASHI KOZO;HAYASHI HARUKI;TOMITA TAKASHI |
分类号 |
H05K3/40;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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