发明名称 MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARD
摘要 PURPOSE:To reduce the number of steps by conducting the step of electrically connecting to be executed for a surface blind viahole of a multilayer printed circuit board simultaneously upon the other step. CONSTITUTION:A land 6 is electrically connected to a land 7 via solder 11 by allowing solder paste 10 to reflow after the paste 10 is metal screen printed on a surface blind viahole 12 of a multilayer printed circuit board.
申请公布号 JPH07183664(A) 申请公布日期 1995.07.21
申请号 JP19930345113 申请日期 1993.12.21
申请人 CMK CORP 发明人 MATSUMOTO MASUO;TAKAHASHI KOZO;HAYASHI HARUKI;TOMITA TAKASHI
分类号 H05K3/40;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/40
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