| 摘要 |
<p>1,097,296. Mounting semi-conductor devices. GENERAL ELECTRIC CO. July 29, 1966 [Aug. 19, 1965], No. 34169/66. Heading H1K. One or more pairs of matched solid-state components are mounted together in such a way as to ensure that the effects of the ambient temperature are the same on each component. As shown matched transistor chips 10, 12 are mounted on a ceramic or glass header 32 to which is bonded a can 36. A lip 37 on the can is gripped between the inwardly projecting lips 44, 46 of a cap 40 and nut 42 of material of high thermal conductivity and is thus held so that the walls of the can and cap are spaced apart to provide thermal insulation. The nut is placed on a printed circuit board 48 to which the transistors are connected (to form the active part of a differential amplifier) and the entire assembly potted in epoxy resin loaded with alumina. Because of its high thermal conductivity the cap and nut assembly rapidly assumes a reasonably uniform temperature in the presence of a temperature differential in the resin on its opposite sides and this together with the high thermal resistance between the outer and inner assemblies ensures that the ambient temperature of the two transistors is the same.</p> |
