| 摘要 |
<p>PURPOSE:To block permeation of external moisture, and improve the reliability of a semiconductor device, by forming a protective film whose moisture permeability is very small between inner layer resin and outer layer resin. CONSTITUTION:A semiconductor chip 1 to be protected from the external atmosphere is fixed to the island 2 of a lead frame. After electrodes of the semiconductor chip 1 are connected with outer leads 3 through metal thin wires 4, the semiconductor chip 1 containing the island 2 and the metal thin wires 4 are wrapped with inner layer resin 5 composed of high purity silicone resin and protected. A nitride film whose moisture permeability is very small is formed on the outer surface of the silicon resin layer constituting the inner layer resin 5, and further the outer surface of the nitride film 6 is wrapped with outer resin layer 7. Thereby permeation of external moisture is blocked, and the semiconductor chip 1 is sufficiently protected from the external moisture, and a semiconductor device excellent in reliability can be provided at a low cost.</p> |
